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SI5933DC Vishay Siliconix Dual P-Channel 1.8-V (G-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) () 0.110 @ VGS = --4.5 V --20 0.160 @ VGS = --2.5 V 0.240 @ VGS = --1.8 V ID (A) --3.6 --3.0 --2.4 S1 S2 1206-8 ChipFETt 1 S1 D1 D1 D2 D2 G1 S2 G2 G1 G2 Marking Code DC XX Lot Traceability and Date Code Part # Code Bottom View D1 P-Channel MOSFET D2 P-Channel MOSFET Ordering Information: SI5933DC-T1 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)b, c TA = 25_C TA = 85_C TA = 25_C TA = 85_C Symbol VDS VGS ID IDM IS PD TJ, Tstg 5 secs Steady State --20 8 Unit V --3.6 --2.6 --10 --1.8 2.1 1.1 --55 to 150 260 --2.7 --1.9 --0.9 1.1 0.6 W A _C THERMAL RESISTANCE RATINGS Parameter Maximum J Mi Junction-to-Ambienta ti t A bi t Maximum Junction-to-Foot (Drain) t 5 sec Steady State Steady State Symbol RthJA RthJF Typical 50 90 30 Maximum 60 110 40 Unit _C/W C/ Notes a. Surface Mounted on 1" x 1" FR4 Board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. Document Number: 71238 S-21251--Rev. B, 05-Aug-02 www.vishay.com 2-1 SI5933DC Vishay Siliconix SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED) Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta VGS(th) IGSS IDSS ID(on) VDS = VGS, ID = --250 mA VDS = 0 V, VGS = 8 V VDS = --16 V, VGS = 0 V VDS = --16 V, VGS = 0 V, TJ = 85_C VDS --5 V, VGS = --4.5 V VGS = --4.5 V, ID = --2.7 A Drain-Source On-State Resistancea rDS(on) VGS = --2.5 V, ID = --2.2 A VGS = --1.8 V, ID = --1 A Forward Transconductancea Diode Forward Voltagea gfs VSD VDS = --10 V, ID = --2.7 A IS = --0.9 A, VGS = 0 V --10 0.095 0.137 0.205 7 --0.8 --1.2 0.110 0.160 0.240 S V --0.45 100 --1 --5 V nA mA A Symbol Test Condition Min Typ Max Unit Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time Qg Qgs Qgd td(on) tr td(off) tf trr IF = --0.9 A, di/dt = 100 A/ms VDD = --10 V, RL = 10 ID --1 A, VGEN = --4.5 V, RG = 6 VDS = --10 V, VGS = --4.5 V, ID = --2.7 A 4.4 1.4 0.65 16 30 30 27 20 25 45 45 40 40 ns 6.5 nC Notes a. Pulse test; pulse width 300 ms, duty cycle 2%. b. Guaranteed by design, not subject to production testing. TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Output Characteristics 10 VGS = 5 thru 3 V 8 I D -- Drain Current (A) 2.5 V I D -- Drain Current (A) 8 10 Transfer Characteristics TC = --55_C 25_C 6 2V 4 6 125_C 4 2 1.5 V 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VDS -- Drain-to-Source Voltage (V) www.vishay.com VGS -- Gate-to-Source Voltage (V) Document Number: 71238 S-21251--Rev. B, 05-Aug-02 2-2 SI5933DC Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) On-Resistance vs. Drain Current 0.6 VGS = 1.8 V r DS(on) -- On-Resistance ( ) 0.5 C -- Capacitance (pF) 600 0.4 0.3 0.2 0.1 0.0 0 2 4 6 8 10 0 0 Crss 4 8 12 16 20 VGS = 2.5 V VGS = 4.5 V Ciss 800 Capacitance 400 200 Coss ID -- Drain Current (A) VDS -- Drain-to-Source Voltage (V) Gate Charge 5 V GS -- Gate-to-Source Voltage (V) VDS = 10 V ID = 2.7 A 4 1.6 On-Resistance vs. Junction Temperature VGS = 4.5 V ID = 2.7 A 1.4 3 r DS(on) -- On-Resistance () (Normalized) 2 3 4 5 1.2 2 1.0 1 0.8 0 0 1 Qg -- Total Gate Charge (nC) 0.6 --50 --25 0 25 50 75 100 125 150 TJ -- Junction Temperature (_C) Source-Drain Diode Forward Voltage 10 0.4 On-Resistance vs. Gate-to-Source Voltage r DS(on) -- On-Resistance ( ) ID = 2.7 A 0.3 I S -- Source Current (A) TJ = 150_C 0.2 TJ = 25_C 0.1 1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5 VSD -- Source-to-Drain Voltage (V) VGS -- Gate-to-Source Voltage (V) Document Number: 71238 S-21251--Rev. B, 05-Aug-02 www.vishay.com 2-3 SI5933DC Vishay Siliconix TYPICAL CHARACTERISTICS (25_C UNLESS NOTED) Threshold Voltage 0.4 0.3 V GS(th) Variance (V) ID = 250 mA 0.2 0.1 0.0 --0.1 --0.2 --50 10 Power (W) 30 50 Single Pulse Power 40 20 --25 0 25 50 75 100 125 150 0 10 --4 10 --3 10 --2 10 --1 Time (sec) 1 10 100 600 TJ -- Temperature (_C) Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Notes: PDM t1 t2 1. Duty Cycle, D = 2. Per Unit Base = RthJA = 90_C/W t1 t2 Single Pulse 0.01 10 --4 10 --3 10 --2 10 --1 1 Square Wave Pulse Duration (sec) 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted 10 100 600 Normalized Thermal Transient Impedance, Junction-to-Foot 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10 --4 10 --3 10 --2 10 --1 Square Wave Pulse Duration (sec) 1 10 www.vishay.com 2-4 Document Number: 71238 S-21251--Rev. B, 05-Aug-02 |
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